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Novel Techniques for Millimeter Wave PackagesA new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented.
Document ID
20210001611
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/33052
Authors
Tulintseff, A.
Kolawa, E.
Lowry, L.
Lee, K.
Herman, M.
Date Acquired
January 1, 1994
Publication Date
January 1, 1994
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
millimeter-wave
package
architecture
multichip
module
applications
low-loss
wideband
RF
photonic
networks

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