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Scaled CMOS technology reliability users guideThis work is sponsored by the NASA Electronic Parts and Packaging (NEPP)
Program. One of the objectives of this task is to prepare a body of knowledge guideline
document summarizing the CMOS technology scaling impact on CMOS parts and parts
reliability for space applications. Scaling impact on parts radiation sensitivity is not
addressed in this report.
Document ID
20210001752
Acquisition Source
Jet Propulsion Laboratory
Document Type
Technical Publication (TP)
External Source(s)
Authors
Chen, Yuan
White, Mark
Date Acquired
May 1, 2008
Publication Date
May 1, 2008
Publication Information
Publisher: Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2008.
Distribution Limits
Public
Copyright
Other
Technical Review

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