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Pb-free microelectronics assembly in aerospace applicationsIn this paper we provide a snapshot of the commericial industry trends and how they may impact electronics in the aerospace environment. Impacts will be felt in the areas of: reliability, assembly methods, cost drivers, supply chain selection and alternate materials selection.
Document ID
20210002428
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Schoenung, Julie M.
Saphores, Jean-Daniel M.
Ogunseitan, Oladele A.
Bonner, J. Kirk
Shaprio, Andrew A.
Date Acquired
March 1, 2004
Publication Date
March 1, 2004
Publication Information
Publisher: Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2004.
Distribution Limits
Public
Copyright
Other
Technical Review

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