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Chip Scale Package IssuesAvailability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
Document ID
20210002502
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/15116
Authors
Ghaffarian, R.
Date Acquired
May 1, 2000
Publication Date
May 1, 2000
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
solder
joint
reliability
chip
scale
package
CSP
mixed
package
technolgy
thermal
cycles

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