NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login

Press Enter or click the Search button to begin your search.

Back to Results
SM Package Miniaturization Trends and Assembly Reliability ChallengesDifferent aspects of advanced surface mount package technology have been investigated. Three key areas included the assembly reliability of conventional Surface Mount (SM), Ball Grid Arrays (BGAs), and Chip Scale Packages (CSPs).
Document ID
20210002683
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/16694
Authors
Ghaffarian, R.
Date Acquired
May 23, 1999
Publication Date
May 23, 1999
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
solder
joint
reliability
surface
mount
technology
SMT
Ball
grid
array
BGA
Chip
Scale
Package
CSP
thermal
cycling
fatigue

Available Downloads

There are no available downloads for this record.

Related Records

There are no records associated with this record.
No Preview Available