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Chip Scale Package Integrity Assessment by Isothermal AgingMany aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes.
Document ID
20210002685
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/16701
Authors
Ghaffarian, R.
Date Acquired
April 7, 1999
Publication Date
April 7, 1999
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
chipscale
package
CPS
ball
grid
arrays
BGA
isothermal
aging
solder
ball
shear
force

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