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Technical Challenges in Reliable MicroelectroniCs Packaging of Microelectromechanical Systems (MEMS) for Space ApplicationsMEMS have shown a significant promise in the last decade for a variety of applications such as air-bag, pressure sensors, accelerometer, microgyro, chemical sensors, artificial nose, etc.
Document ID
20210002818
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/17098
Authors
Ramesham, R.
Date Acquired
May 1, 1999
Publication Date
May 1, 1999
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
Packaging
Microelectromechinical
Systems
(MEMS)
Space
Application
integrated
circuits

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