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Technical Challenges in Reliable Microelectronics Packaging of Microelectromechanical System (MEMS) for Space ApplicaitonsUNKNOWN
Document ID
20210003086
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/18894
Authors
Ramesham, R.
Date Acquired
January 1, 1999
Publication Date
January 1, 1999
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
reliability
microelectronics
packaging
Microelectromechanical
System
(MEMS)

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