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A 90 GHz Amplifier Assembled Using a Bump-Bonded InP-based HEMTWe report on the performance of a novel W-band amplifier fabricated utilizing very compact bump bonds.
Document ID
20210003316
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/17403
Authors
Martin, S.
Fitzsimmons, M.
Ksendzov, A.
Smith, R.
Gaier, T.
Pinsukanjana, P.
Samoska, L.
Date Acquired
October 17, 1999
Publication Date
October 17, 1999
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
amplifies
HEMT
W-band
InP
MMIC

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