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A Review and Prediction of Chip Scale Solder Joint ReliabilityAvailability of board level solder joint reliability information is critical to the acceptance of CSPs as alternative packages. This paper will review different CSPs as well as their assembly reliability.
Document ID
20210003464
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/22265
Authors
Ghaffarian, Reza
Date Acquired
October 12, 1997
Publication Date
October 12, 1997
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
Chip
Scale
solder
joint

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