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Reliability Modeling of MCMs - RELTECH Lessons LearnedThe rapid development of advanced electronic packaging and interconnect technologiew, specifically MCMs, requires effective ways of evaluating the reliability of these packages...
Document ID
20210003671
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/24305
Authors
Stoklosa, Mark
Gersch, Glenn
Larson, Timothy W.
Newell, James M.
Date Acquired
April 17, 1996
Publication Date
April 17, 1996
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
MCM
packaging
reliability
modeling
analysis
thermo-mechanical

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