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Transmission Lines for High Frequency and High Density PackagingWe report on resistivity and chemical stability of Cr/Au bilayers deposited by sputtering on three kinds of substrates: alumina, aluminum nitride and aluminum nitride coated alumina. The insertion loss of Cr/Au microstrip lines fabricated on these three substrates was low and stable after 100 cycles in the -65 degree C to 125 degree C temperature range.
Document ID
20210004215
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/33235
Authors
Lee, K.
Herman, M.
Lowry, L.
Kolawa, E.
Date Acquired
November 7, 1994
Publication Date
November 7, 1994
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
high-frequency
packaging
high-density
packaging
microwave/millimeter-wave
packages
Cr/Au
microstrip
lines
transmission
lines

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