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Advanced Interconnect Roadmap For Space ApplicationsA roadmap giving technology forecasts and recommendations for research direction for advanced electronic interconnection technology for space applications is presented.
Document ID
20210005526
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/20558
Authors
Galbraith, L.
Date Acquired
November 16, 1998
Publication Date
November 16, 1998
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
interconnection
electronic
packaging
ball
grid
arrays
chip
scale
packages
printed
wiring
assembly
roadmap
area
arrays
technology
forecast

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