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High density packaging technologies for RF electronics in small spacecraftUNKNOWN
Document ID
20210007782
Acquisition Source
Jet Propulsion Laboratory
Document Type
Presentation
External Source(s)
Authors
Schatzel, Don
Aguirre, Fernando
Date Acquired
March 4, 2017
Publication Date
March 4, 2017
Publication Information
Publisher: Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2017
Distribution Limits
Public
Copyright
Other
Technical Review

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