Auto-Gopher-II – A wireline rotary-hammer ultrasonic drill that operates autonomously

An important challenge of exploring the solar system is the ability to penetrate at great depths the subsurface of planetary bodies for sample collection. The requirements of the drilling system are minimal mass, volume and energy consumption. To address this challenge, a deep drill, called the Auto-Gopher II, is currently being developed as a joint effort between JPL’s NDEAA laboratory and Honeybee Robotics Corp. The Auto-Gopher II is a wireline rotaryhammer drill that combines breaking formations by hammering using a piezoelectric actuator and removing the cuttings by rotating a fluted bit. The hammering is produced by the Ultrasonic/Sonic Drill/Corer (USDC) mechanism that has been developed by the JPL team as an adaptable tool for many drilling and coring applications. The USDC uses an intermediate free-flying mass to convert high frequency vibrations of a piezoelectric transducer horn tip into sonic hammering of the drill bit. The USDC concept was used in a previous task to develop an Ultrasonic/Sonic Ice Gopher and then integrated into a rotary hammer device to develop the Auto-Gopher-I. The lessons learned from these developments are being integrated into the development of the Auto-Gopher-II, an autonomous deep wireline drill with integrated cuttings and sample management and drive electronics. In this paper the latest development will be reviewed including the piezoelectric actuator, cuttings removal and retention flutes and drive electronics.