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NASA and FMI - Developing Enabling TPSPICA and HEEET/3MDCP are proven and capable TPS solutions that are needed for the majority of future SMD-PSD missions. FMI has been a critical partner in the development of both PICA and HEEET as FMI's manufacturing capabilities are essential for the large-scale processing of PICA, HEEET and 3MDCP TPS materials in support of countless past and future NASA missions acrosss the solar system.
Document ID
20210011656
Acquisition Source
Ames Research Center
Document Type
Poster
Authors
Matthew J Gasch (Ames Research Center Mountain View, California, United States)
Date Acquired
March 19, 2021
Subject Category
Engineering (General)
Spacecraft Design, Testing And Performance
Meeting Information
Meeting: FMI Ribbon Cutting
Location: Biddeford, ME
Country: US
Start Date: August 19, 2021
Sponsors: Ames Research Center
Funding Number(s)
WBS: 829688.14.05.02.02.05.02
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Technical Review
NASA Peer Committee
Keywords
PICA-D
HEEET
3MDCP
Sample Return Missions
FMI

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