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A 3D-printed Broadband Millimeter Wave AbsorberWe present the design, manufacturing technique, and characterization of a 3D-printed broadband graded index millimeter wave absorber. The absorber is additively manufactured using a fused filament fabrication (FFF) 3D printer out of a carbon-loaded high impact polystyrene (HIPS) filament and is designed using a space-filling curve to optimize manufacturability using said process. The absorber's reflectivity is measured from 63 GHz to 115 GHz and from 150 GHz to 215 GHz and is compared to electromagnetic simulations. The intended application is for terminating stray light in Cosmic Microwave Background (CMB) telescopes, and the absorber has been shown to survive cryogenic thermal cycling.
Document ID
20210012855
Acquisition Source
Goddard Space Flight Center
Document Type
Reprint (Version printed in journal)
Authors
Matthew Petroff (Johns Hopkins University Baltimore, Maryland, United States)
John Appel (Johns Hopkins University Baltimore, Maryland, United States)
Karwan Rostem (Goddard Space Flight Center Greenbelt, Maryland, United States)
Charles L Bennett (Johns Hopkins University Baltimore, Maryland, United States)
Joseph Eimer (Johns Hopkins University Baltimore, Maryland, United States)
Tobias Marriage (Johns Hopkins University Baltimore, Maryland, United States)
Joshua Ramirez (John Hopkins University Applied Physics Lab)
Edward J Wollack (Goddard Space Flight Center Greenbelt, Maryland, United States)
Date Acquired
March 31, 2021
Publication Date
February 1, 2019
Publication Information
Publication: Review of Scientific Instruments
Publisher: AIP
Volume: 90
Issue: 2
ISSN: 0034-6748
e-ISSN: 1089-7623
URL: https://aip.scitation.org/doi/10.1063/1.5050781
DOI: 10.1063/1.5050781
Subject Category
Spacecraft Instrumentation And Astrionics
Funding Number(s)
WBS: 920121
CONTRACT_GRANT: 80NSSC19M0005
CONTRACT_GRANT: NNN15AA05T
CONTRACT_GRANT: NSFDAS0959349
CONTRACT_GRANT: NSFDAS1429236
CONTRACT_GRANT: NSFDAS1636634
CONTRACT_GRANT: NSFDAS1654494
Distribution Limits
Public
Copyright
Use by or on behalf of the US Gov. Permitted.
Technical Review
External Peer Committee

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