Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Peter Majewicz (Goddard Space Flight Center Greenbelt, Maryland, United States) Yuan Chen (Langley Research Center Hampton, Virginia, United States) Date Acquired
May 3, 2021
Publication Date
May 17, 2021
Publication Information
Publication: Presentation for posting on public website
Publisher: NASA Electronic Parts and Packaging (NEPP) Program
URL: https://nepp.nasa.gov/
Subject Category
Electronics And Electrical EngineeringQuality Assurance And Reliability Meeting Information
Meeting: TRISMAC 2021 Trilateral Safety & Mission Assurance Conference (TRISMAC)
Location: virtual
Country: US
Start Date: May 17, 2021
End Date: May 24, 2021
Sponsors: Japan Aerospace Exploration Agency, NASA Headquarters Office of Safety and Mission Assurance (OSMA)
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Technical Review
Single Expert
Keywords
commercialqualityassurancesemiconductorsmicrocircuit