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Additively Printed Flexible Temperature Sensor for Wearable ApplicationsThe flexible sensor has the capability to be mounted on any curved surfaces of applications and be used for portable devices. Additively printed sensors have received attention owing to their compact design and ability of application to non-planar surfaces. Wearable applications require capability of integration into a variety of surfaces with ability to flex, fold, twist and stretch under the stresses of daily motion. There is scarcity of data on the interaction of the process parameters with the realized performance. In addition, there is need for data focused on sensor accuracy, repeatability, and reliability. In this study, experimental analysis on function of the fabricated sensing board is conducted. The temperature sensors are made by direct write printing method with nScrypt printer. A calibration of the sensors has been conducted to confirm that resistance is well related to actual temperature and find TCR (temperature coefficient to resistance). The evolution of resistance has been correlated with the environmental temperature. The sensor hysteresis has been quantified using upswing and downswing of the environmental temperature. In addition, the effect of humidity on the temperature sensor accuracy and performance has been quantified. The effect of a polymide coat on the sensor to prevent humidity effects has also been quantified.
Document ID
20210015682
Acquisition Source
Marshall Space Flight Center
Document Type
Conference Paper
Authors
Pradeep Lall
(Auburn University Auburn, Alabama, United States)
Hyesoo Jang
(Auburn University Auburn, Alabama, United States)
Jinesh Narangaparambil
(Auburn University Auburn, Alabama, United States)
Kartik Goyal
(Auburn University Auburn, Alabama, United States)
Curtis Hill
(Jacobs (United States) Dallas, Texas, United States)
Date Acquired
May 17, 2021
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
IPACK2021-74071
Meeting Information
Meeting: InterPACK: International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Location: Virtual
Country: US
Start Date: October 26, 2021
End Date: October 28, 2021
Sponsors: American Society of Mechanical Engineers
Funding Number(s)
CONTRACT_GRANT: 80MSFC18C0011
Distribution Limits
Public
Copyright
Use by or on behalf of the US Gov. Permitted.
Technical Review
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