Acquisition Source
Marshall Space Flight Center
Document Type
Conference Paper
Authors
Pradeep Lall (Auburn University Auburn, Alabama, United States) Hyesoo Jang (Auburn University Auburn, Alabama, United States) Jinesh Narangaparambil (Auburn University Auburn, Alabama, United States) Kartik Goyal (Auburn University Auburn, Alabama, United States) Curtis Hill (Jacobs (United States) Dallas, Texas, United States) Date Acquired
May 17, 2021
Subject Category
Electronics And Electrical Engineering Meeting Information
Meeting: InterPACK: International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Location: Virtual
Country: US
Start Date: October 26, 2021
End Date: October 28, 2021
Sponsors: American Society of Mechanical Engineers
Funding Number(s)
CONTRACT_GRANT: 80MSFC18C0011
Distribution Limits
Public
Copyright
Use by or on behalf of the US Gov. Permitted.
Technical Review
Single Expert