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Thermal Conductivity of 3D Woven Composite Thermal Protection System Materials via Multiscale Recursive MicromechanicsMultiscale micromechanics predictions have been made for the effective thermal conductivities and local thermal fields for a novel 3D woven composite thermal protection system material. The Multiscale Recursive Micromechanics approach, which enables micromechanics models to call other micromechanics models (or themselves recursively) to consider finer and finer length scales, has been employed. The multiscale model uses a recently developed version of the High-Fidelity Generalized Method of Cells micromechanics theory at each of three length scales. Results focus on the impact of the microstructural geometry representation at each length scale on the material’s effective thermal conductivity, along with the local thermal flux and temperature fields induced in the microstructures.
Document ID
20210025587
Acquisition Source
Glenn Research Center
Document Type
Conference Paper
Authors
Brett A. Bednarcyk
(Glenn Research Center Cleveland, Ohio, United States)
Trenton M. Ricks
(Glenn Research Center Cleveland, Ohio, United States)
Evan J. Pineda
(Glenn Research Center Cleveland, Ohio, United States)
Pappu L.N. Murthy
(Glenn Research Center Cleveland, Ohio, United States)
Subodh K. Mital
(University of Toledo Toledo, Ohio, United States)
Zhong Hu
(South Dakota State University Brookings, South Dakota, United States)
Peter A. Gustafson
(Western Michigan University Kalamazoo, Michigan, United States)
Date Acquired
December 7, 2021
Subject Category
Structural Mechanics
Meeting Information
Meeting: AIAA SciTech Forum
Location: San Diego, CA
Country: US
Start Date: January 3, 2022
End Date: January 7, 2022
Sponsors: American Institute of Aeronautics and Astronautics
Funding Number(s)
WBS: 335803.04.22.22.10.03
Distribution Limits
Public
Copyright
Public Use Permitted.
Technical Review
Single Expert
Keywords
Composites
Thermal Protection Systems
Carbon/Phenolic
High-Fidelity Generalized Method of Cells
Micromechanics
Thermal Conductivity
Heat Flux
Microstructure
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