Role of NDE and In-Situ Process Monitoring in Managing Risk of AM Space Hardware

The recently published NASA-STD-6030 defines the Additive Manufacturing (AM) Requirements for Spaceflight Systems. Key aspects of the certification approach include the development of a qualified material process (QMP) and material characterization determined by part classification. Nondestructive evaluation (NDE) of the full surface and volume is required for all part classifications except those with negligible risk. NASA is exploring the use of in-process monitoring data to improve risk posture and supplement post-build inspection for complex parts. Currently, the most challenging obstacle to overcome is linking the indications in the monitoring data to the physics of the process and the final material state of the finished part. NASA is undertaking studies to understand and quantify this relationship for various monitoring methods. The desired goal is to develop a protocol to establish this correlation for any monitoring method. Once this correlation is known, the critical defect size can be linked to a representative indication in the monitoring data, and the capability of the monitoring system can be tested using the 90/95 probability of detection requirement for NDE methods. This would enable the use of in-process monitoring as a defect screening activity for AM part certification. Many high-criticality components built with AM have high complexity and therefore limited inspectability, so using in-process monitoring can help address this certification gap. The use of adaptive, closed-loop monitoring systems that alter the locked process will require a new approach to the QMP.