In-situ Testing to Acquire HR-EBSD and DIC Strain Data Within a Coincident Domain

For this project, an inked rubber stamp was applied to a small
Inconel 625 specimen. The stamp transferred a thin pattern with
microscale features for digital image correlation (DIC). The pattern
is easily visible at lower voltages and thin enough to not obstruct
backscattered electrons. The unique characteristics of the pattern
enabled the concurrent acquisition of DIC and high-resolution
electron backscatter diffraction (HR-EBSD) data while the
specimen was loaded in-situ. The challenges of in-situ testing and
combining EBSD with DIC measurements are discussed. By
combining the elastic strains (from HR-EBSD) and total strains
(from DIC) the result of this approach is an estimate of stress-
strain behavior at points across the specimen surface. This
combined dataset can then be used as higher-fidelity data in the
calibration of crystal plasticity models.