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Recent Issues in Laser Diode Packaging for High Reliability Applications
Document ID
20220009213
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Hali Jakeman Flores (Goddard Space Flight Center Greenbelt, Maryland, United States)
Rob Switzer (Science Systems and Applications (United States) Lanham, Maryland, United States)
Joe Thomes (Goddard Space Flight Center Greenbelt, Maryland, United States)
Date Acquired
June 10, 2022
Publication Date
July 29, 2022
Publication Information
Publication: Presentation for posting on public website
Publisher: NASA Electronic Parts and Packaging (NEPP) Program
URL: https://nepp.nasa.gov/
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: NEPP Electronics Technology Workshop (ETW)
Location: Greenbelt, MD
Country: US
Start Date: June 13, 2022
End Date: June 16, 2022
Sponsors: NASA Electronic Parts and Packaging (NEPP) Program
Funding Number(s)
WBS: 817091.40.31.51.02
Distribution Limits
Public
Copyright
Public Use Permitted.
Technical Review
Single Expert

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