Acquisition Source
2230 Support
Document Type
Accepted Manuscript (Version with final changes)
Authors
John Bell (Clemson University Clemson, South Carolina, United States) Laura Redmond (Clemson University Clemson, South Carolina, United States) Kalind Carpenter (Jet Propulsion Lab La Cañada Flintridge, California, United States) Jean-Pierre De La Croix (Jet Propulsion Lab La Cañada Flintridge, California, United States) Date Acquired
August 24, 2022
Publication Date
April 7, 2022
Publication Information
Publication: Journal of Microelectronics and Electronics Packaging
Publisher: International Microelectronics And Packaging Society (IMAPS)
Volume: 19
Issue: 1
Issue Publication Date: January 1, 2022
Subject Category
Computer Operations And Hardware Funding Number(s)
CONTRACT_GRANT: 80NM0018D0004
CONTRACT_GRANT: 80NSSC20M0054
Distribution Limits
Public
Copyright
Portions of document may include copyright protected material.