Minimally Intrusive Single-Chip Recession/Temperature Sensors for Spacecraft Thermal Protection Systems

We report the initial results of ongoing development of minimally intrusive, single-chip integrated capacitive recession/temperature sensors that would provide real-time monitoring of ablation recession of heatshield thermal protection systems (TPS) during spacecraft atmospheric entry. This work, which was performed using Phenolic Impregnated Carbon Ablator (PICA), is also to demonstrate the ease of sensor insertion during TPS manufacturing, thereby resulting in faster, low-cost, uniform sensor assembly, and spatial distribution, without compromising TPS structural integrity. Using oxy-acetylene flame at 500 W-cm-2 heat flux for 16 seconds, the average recession depth of 3.25 mm was obtained. Some measurement problems were encountered in this first attempt. However, the initial results obtained are in relatively good agreement with published data, and offer promise of future improvement based on lessons learned.