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Additive Manufacturing of Electronics for Space ApplicationsAdditive manufacturing techniques for electronics will enable new detector and electronic assemblies that were not previously possible with traditional assembly processes. This technology has the potential to reduce mass and volume for fabrication and assembly of detector, instrument, and electronics concepts by printing fine feature sizes, printing on complex geometries, and allowing new concept production. This presentation summarizes efforts developing printing techniques to manufacture detectors and circuitry for two different space applications.
Document ID
20230002984
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Beth Paquette
(Goddard Space Flight Center Greenbelt, Maryland, United States)
Date Acquired
March 6, 2023
Subject Category
Electronics and Electrical Engineering
Mechanical Engineering
Meeting Information
Meeting: TechBlick Additive Electronics in Semiconductor Packaging and PCBs Conference
Location: Virtual
Country: US
Start Date: March 29, 2023
End Date: March 30, 2023
Sponsors: KGH Concepts GmbH
Funding Number(s)
WBS: 981698.01.02.51.07.10.08
Distribution Limits
Public
Copyright
Portions of document may include copyright protected material.
Technical Review
NASA Peer Committee
Keywords
Additive Manufacturing
Printed Hybrid Electronics
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