Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Beth Paquette (Goddard Space Flight Center Greenbelt, Maryland, United States) Date Acquired
March 6, 2023
Subject Category
Electronics and Electrical EngineeringMechanical Engineering Meeting Information
Meeting: TechBlick Additive Electronics in Semiconductor Packaging and PCBs Conference
Location: Virtual
Country: US
Start Date: March 29, 2023
End Date: March 30, 2023
Sponsors: KGH Concepts GmbH
Funding Number(s)
WBS: 981698.01.02.51.07.10.08
Distribution Limits
Public
Copyright
Portions of document may include copyright protected material.
Technical Review
NASA Peer Committee
Keywords
Additive ManufacturingPrinted Hybrid Electronics