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Particle-Based Fiber Models of Woven Materials for Earth Entry Thermal Protection Applications requiring materials with layer-to-layer strength, from basketry to thermal protection systems, use interlaced, three-dimensional woven materials. NASA is developing and deploying woven material heat shields for missions, including Artemis I (3D-MAT for compression pads) and potentially Mars Sample Return - Earth Entry System. These materials are complex, hierarchical and must protect from extreme environments and phenomena, such as deformation, impact and high-enthalpy heating. Woven material performance depends on microstructure, damage and weave geometry. Therefore, fiber-specific models are needed to simulate fiber contacts within the weave hierarchical geometry (fiber to tow to yarn to weave) and the inherent directionality of fibers.

Explicit fiber models can simulate how weave microstructure evolution affects thermal and mechanical properties. We parameterize a discrete element bonded particle models (DEM-BPM) of fibers to capture thermal and mechanical behavior within and between fibers, with bonded and contact forces, respectively. We study the proportion of heat transfer and stress via the contact network, fiber bonds and the weave geometry, for example, with respect to yarn warp-weft identity (whether it interlaces weave layers). Our results demonstrate the importance of explicit fiber modeling for connecting microstructure with thermal and mechanical properties.
Document ID
20230003940
Acquisition Source
Ames Research Center
Document Type
Presentation
Authors
Andrew P Santos
(Analytical Mechanics Associates (United States) Hampton, Virginia, United States)
Lauren J Abbott
(Ames Research Center Mountain View, California, United States)
Justin B Haskins
(Ames Research Center Mountain View, California, United States)
Date Acquired
March 23, 2023
Subject Category
Chemistry and Materials (General)
Composite Materials
Meeting Information
Meeting: 8th International Conference on Particle-Based Methods (Particles 2023)
Location: Milan
Country: IT
Start Date: October 9, 2023
End Date: October 11, 2023
Sponsors: International Center for Numerical Methods in Engineering, European Community on Computational Methods in Applied Sciences (ECCOMAS)
Funding Number(s)
TASK: 101300.08B.TSM.02.03
Distribution Limits
Public
Copyright
Public Use Permitted.
Technical Review
NASA Peer Committee
Keywords
woven material
TPS
fiber
discrete element method
DEM
BPM
MD
LAMMPS
bonded particle model
weave
thermal conductivity
deformation
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