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Thermal Management System Modeling in the Heat Transport System Simulation (HeaTSSPy) Package This paper describes the development of a thermal management system (TMS) concept design and analysis software package called Heat Transport System Simulation (HeaTSSPy). Built within Python using the OpenMDAO framework, HeaTSSPy can be used to size and optimize an active (using liquid/air heat exchangers) or passive (using finned heat sinks) TMS. The package makes use of modular TMS elements that allow for the creation of different system architectures and includes components such as heat sinks, heat exchangers, liquid pumps, fans, ducts, air inlets, air nozzles, and liquid pipes. Modeling methods for these components include a combination of physics-based analytical and empirical equations that relate component sizing criteria to system performance. The HeatSSPy heat sink methods are fully detailed within this paper, while the heat exchanger methods are described and referenced from previous work. This paper also uses high-fidelity simulation to validate two different methods of calculating thermal resistance using CFD results. Once the methods are fully described, the code is exercised to compare an active TMS with that of a passive TMS. Design criteria for this study include rejected heat, system altitude, Mach number, and ambient temperature. These criteria are used to develop a TMS system with estimated performance metrics such as weight, drag, and operational power. Results of this paper show the crossover point when a passive system begins to weigh more than an active system for a given heat rejection.
Document ID
20230011420
Acquisition Source
Glenn Research Center
Document Type
Technical Memorandum (TM)
Authors
Jeffryes W. Chapman
(Glenn Research Center Cleveland, Ohio, United States)
Hashmatullah Hasseeb
(Glenn Research Center Cleveland, Ohio, United States)
Sydney L. Schnulo
(Glenn Research Center Cleveland, Ohio, United States)
Date Acquired
August 2, 2023
Publication Date
August 1, 2023
Publication Information
Subject Category
Aircraft Design, Testing and Performance
Fluid Mechanics and Thermodynamics
Computer Programming and Software
Report/Patent Number
E-20149
AIAA 2023-4127
Meeting Information
Meeting: AIAA/IEEE Electric Aircraft Technologies Symposium (EATS)
Location: San Diego, CA
Country: US
Start Date: June 12, 2023
End Date: June 16, 2023
Sponsors: American Institute of Aeronautics and Astronautics, Institute of Electrical and Electronics Engineers
Funding Number(s)
WBS: 664817.02.03.04.01.01
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Technical Review
Single Expert
Keywords
Thermal management system
electrified aircraft
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