3D Woven Mid-Density Carbon Phenolic (3MDCP) Thermal Protection System Development

3-Dimensionally Woven, Mid-Density, Carbon Phenolic (3MDCP) Thermal Protection System (TPS) material is derived from the dual layer 3D woven Heatshield for Extreme Entry Environment Technology (HEEET) material. The baseline 3MDCP design is a single piece thermal protection system that avoids the manufacturing and certification challenges associated with a tiled configuration. 3MDCP is targeted for very aggressive entry environments such as high-speed sample return missions to Earth and missions to Saturn, Venus and the ice giants.

A 3MDCP heatshield begins as a flat woven preform that is formed to a given heatshield shape and then infused with phenolic resin. NASA Ames, in collaboration with TEAM Inc. (weaving) and Fiber Materials Inc. (both Spirit AeroSystems Companies) have been developing and demonstrating the manufacturing processes to fabricate a 3MDCP heatshield at a diameter of 1.25 meters. The process of forming the flat woven preform into the final heatshield shape, a sphere-cone geometry, involves local movement of the yarns in the weave. This results in a single piece heatshield with continuous fibers, albeit with property variations between different regions on the heatshield.

This presentation will provide a high-level status of 3MDCP development. This will include an overview of the manufacturing processes, with an emphasis on the impact of forming on fiber orientation, material properties and performance. The presentation will layout the plan for testing to assess the impact of forming on properties and review preliminary data comparing properties of flat to formed materials.