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Document ID
20240004132
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Date Acquired
April 5, 2024
Subject Category
Meeting Information
Meeting: CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Summit
Location: Moffett Field, CA
Country: US
Start Date: April 18, 2024
End Date: April 19, 2024
Sponsors: National Institute of Standards and Technology, Ames Research Center
Funding Number(s)
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Technical Review
Single Expert
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