Passive Cooling for Mercury Surface Lander Electronics

A significant barrier to operation of a mission on the surface of Mercury is the temperature. At Mercury’s perihelion distance of 0.313 AU, the solar intensity is 10.6 times the solar flux at Earth orbit, and at the subsolar point, the maximum surface temperature reaches 427°C. For a mission landing on the surface of Mercury at latitude of 40°S, we analyzed using passive thermal control to reduce the temperature of the critical electronics to within the operation temperature limits of silicon devices. The thermal control requires reducing the thermal conductance and infrared flux from the high temperature surface and surrounding spacecraft, and moderating the solar heat input using a surface coating with high solar reflectivity, and maximizing thermal cooling with high infrared emissivity. Using this approach, we find that we can passively cool an electronics box to a temperature of 393K (120°C) using a radiator-white surface with solar absorptivity 0.11 and infrared emissivity 0.91. This temperature is well under 175C target we use for the limits of high-temperature silicon integrated circuits, including RAM and microcontrollers. We could further reduce this operating temperature to as low as 321K (48°C) with an advanced thermal coating, a temperature well within the operational limits of conventional electronics.