Development and Validation of a High-Vacuum Thermal Conductivity Testbed for Aerospace Interface Materials

Spacecraft thermal margins depend on the temperature penalty of installed interfaces, yet catalog conductivity omits bondline thickness, mating surfaces, preload, and environment. The Testbed for Advanced Interface Materials in Vacuum (TAIMV) addresses this engineering-data gap by
converting ambient/vacuum temperature fields from a four-coupon stack into quantities usable in spacecraft thermal models. Its 17-node steady-state model resolves axial conduction, parasitic fixture paths, grease-filled contact, radiation, and ambient convection. Four monolithic checks gave axial heat-rate ratios of 0.90–1.02, and Braycote calibration self-recovery gave 2.20%
casewise mean absolute percentage error (MAPE) and 2.85% maximum difference. With transferable fixture terms frozen, Krytox LVP tested cross-material transfer against a manufacturer-derived external relation. The six Krytox cases gave 2.28% MAPE, 5.10% maximum difference, and full-field residual root-mean-square values of 0.553 °C ambient and 1.306 °C vacuum. Installed-joint resistance spanned 6.39–7.15 × 10⁻⁴ m²·K/W for Braycote and 4.09–4.49 × 10⁻⁴ m²·K/W for Krytox, corresponding to 2.33–6.66 K per modeled interface over the tested heat-flux range. TAIMV therefore supplies directly usable installed-joint resistance and conductance, plus apparent installed conductivity and explicitly model-conditioned grease conductivity/contact terms.