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Metallographic examination of soldering of multilayer boards for airlockMicrostructure and void formation in solder connections of components on multilayer boards
Document ID
19690030077
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Huffstutler, R. M. (McDonnell-Douglas Corp. Saint Louis, MO, United States)
Date Acquired
August 4, 2013
Publication Date
September 15, 1969
Subject Category
Machine Elements And Processes
Report/Patent Number
REPT-061-015-76
NASA-CR-101956
Report Number: REPT-061-015-76
Report Number: NASA-CR-101956
Accession Number
69N39462
Funding Number(s)
CONTRACT_GRANT: NAS9-6555
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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