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Annealing effects in plated-wire memory elements. I - Interdiffusion of copper and Permalloy.Results of investigations using X-ray diffraction and electron-beam microprobe techniques have shown that copper and Permalloy platings interdiffuse at low temperatures when plated-wire memory elements are annealed for times as short as 50 hr. Measurable interdiffusion between Permalloy platings and gold substrates does not occur in similar conditions. Both magnetic and compositional changes during aging are found to occur by a thermally activated process with activation energies around 38 kcal/mol. It is shown, however, that copper-diffusion and magnetic-dispersion changes during aging are merely concurrent processes, neither being the other's cause.
Document ID
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Knudson, C. I.
Kench, J. R.
(Honeywell Corporate Research Center Hopkins, Minn., United States)
Date Acquired
August 6, 2013
Publication Date
December 1, 1971
Publication Information
Publication: IEEE Transactions on Magnetics
Volume: MAG-7
Subject Category
Electronic Equipment
Accession Number
Distribution Limits

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