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Heat pipe applications for the space shuttle.Discussion of six specific applications for heat pipe (HP) devices on the space shuttle. These applications were chosen from 27 concepts formulated as part of a study to evaluate the potential benefits associated with HP use. The formulation process is briefly described along with the applications which evolved. The bulk of the discussion deals with the 'top' six - namely, HP radiators for waste heat rejection, an HP augmented cold rail, an HP circuit for electronic equipment cooling, modular heat sink for control of remote packages, an HP temperature control for compartments, and air-cooled equipment racks. The philosophy, physical design details, and performance data are presented for each concept along with a comparison with the baseline design where applicable.
Document ID
19720041546
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Tawil, M.
Alario, J.
Prager, R.
(Grumman Aerospace Corp. Bethpage, N.Y., United States)
Bullock, R.
(NASA Manned Spacecraft Center Houston, Tex., United States)
Date Acquired
August 6, 2013
Publication Date
April 1, 1972
Subject Category
Space Vehicles
Report/Patent Number
AIAA PAPER 72-272
Meeting Information
Meeting: American Institute of Aeronautics and Astronautics, Thermophysics Conference
Location: San Antonio, TX
Start Date: April 10, 1972
End Date: April 12, 1972
Sponsors: American Institute of Aeronautics and Astronautics
Accession Number
72A25212
Distribution Limits
Public
Copyright
Other

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