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In situ sputter cleaning of thin film metal substrates for UHV-TEM corrosion studies.A prerequisite for conducting valid corrosion experiments by in situ electron microscopy techniques is not only the achievement of UHV background pressure conditions at the site of the specimen but also the ability to clean the surface of the thin metal substrate specimen before initiation of the corrosive interaction. A miniaturized simple ion gun has been constructed for this purpose. The gun is small enough to be incorporated into an UHV electron microscope specimen chamber with hot stage in such a way as to permit bombardment of the substrate specimen while observing it by transmission electron microscopy TEM. It is shown that the ion beam generated is confined well enough to cause a sputtering removal of substrate material at a rate of approximately 5-10 A/min and to prevent the sputter deposition of contaminating material from the specimen holder.
Document ID
19730036814
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Heinemann, K.
(NASA Ames Research Center Moffett Field; Stanford University, Stanford, Calif., United States)
Poppa, H.
(NASA Ames Research Center Moffett Field, Calif., United States)
Date Acquired
August 7, 2013
Publication Date
February 1, 1973
Subject Category
Physics, Atomic, Molecular, And Nuclear
Accession Number
73A21616
Funding Number(s)
CONTRACT_GRANT: NGR-05-020-569
Distribution Limits
Public
Copyright
Other

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