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Using the NASTRAN Thermal Analyzer to simulate a flight scientific instrument packageThe NASTRAN Thermal Analyzer has proven to be a unique and useful tool for thermal analyses involving large and complex structures where small, thermally induced deformations are critical. Among its major advantages are direct grid point-to-grid point compatibility with large structural models; plots of the model that may be generated for both conduction and boundary elements; versatility of applying transient thermal loads especially to repeat orbital cycles; on-line printer plotting of temperatures and rate of temperature changes as a function of time; and direct matrix input to solve linear differential equations on-line. These features provide a flexibility far beyond that available in most finite-difference thermal analysis computer programs.
Document ID
19740053270
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Lee, H.-P.
Jackson, C. E., Jr.
(NASA Goddard Space Flight Center Greenbelt, Md., United States)
Date Acquired
August 7, 2013
Publication Date
January 1, 1974
Subject Category
Instrumentation And Photography
Meeting Information
Meeting: Annual Meeting on the Cost effectiveness in the environmental sciences
Location: Washington, DC
Start Date: April 28, 1974
End Date: May 1, 1974
Accession Number
74A36020
Distribution Limits
Public
Copyright
Other

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