Mixed mode stress field effect in adhesive fracture

Numerical or analytical analyses were performed on seven different test specimens including blister test, 90-degree peel test, torsion test, and various cone tests. These specimens are in general subjected to complex stress fields having various amounts of Mode I, Mode II, and Mode III loads. The specimens were then constructed using polymethyl methacrylate for the adherends and a transparent polyurethane elastomer (Solithane 113) for the adhesive. This combination permitted direct observation of the bondline as load was applied. Although initial debonds as well as bond end termination singularities were present in all specimens, in some cases the debond did not initiate at the singularity points as would normally have been expected. An explanation for this behavior is presented, as well as a comparison of loading mode effect on those specimens for which the debond did propagate from a bond terminus singular point.