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A method for the dynamic and thermal stress analysis of space shuttle surface insulationThe thermal protection system of the space shuttle consists of thousands of separate insulation tiles bonded to the orbiter's surface through a soft strain-isolation layer. The individual tiles are relatively thick and possess nonuniform properties. Therefore, each is idealized by finite-element assemblages containing up to 2500 degrees of freedom. Since the tiles affixed to a given structural panel will, in general, interact with one another, application of the standard direct-stiffness method would require equation systems involving excessive numbers of unknowns. This paper presents a method which overcomes this problem through an efficient iterative procedure which requires treatment of only a single tile at any given time. Results of associated static, dynamic, and thermal stress analyses and sufficient conditions for convergence of the iterative solution method are given.
Document ID
19750048607
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Ojalvo, I. U.
Levy, A.
Austin, F.
(Grumman Aerospace Corp. Bethpage, N.Y., United States)
Date Acquired
August 8, 2013
Publication Date
May 1, 1975
Subject Category
Structural Mechanics
Report/Patent Number
AIAA PAPER 75-801
Meeting Information
Meeting: AIAA, ASME, and SAE, Structures, Structural Dynamics, and Materials Conference
Location: Denver, CO
Start Date: May 27, 1975
End Date: May 29, 1975
Sponsors: SAE, ASME, AIAA
Accession Number
75A32679
Funding Number(s)
CONTRACT_GRANT: NAS1-10635-19
CONTRACT_GRANT: NAS1-10635-17
Distribution Limits
Public
Copyright
Other

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