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Purity test for copper-plating solutionsElectrode configuration can be used to measure extent of impurities in acid-copper plating solution. It can be inserted into any plating tank and will show whether bath is clean or contaminated, within fifteen minutes.
Document ID
19760000360
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Mansfeld, F. B.
(Rockwell Intern. Corp.)
Date Acquired
August 8, 2013
Publication Date
January 1, 1977
Publication Information
Publication: NASA Tech Briefs
Volume: 1
Issue: 3
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
MFS-19298
Accession Number
76B10360
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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