Stress intensity factors for deep cracks emanating from the corner formed by a hole intersecting a plate surface

The stress intensity factors (SIFs) at the end points of flaws emanating from the corner formed by the intersection of a plate with a hole were determined using stress freezing photoelasticity and a numerical technique known as the Taylor series correction method to extract the SIF values from the photoelastic data. The geometries studied were crack depth to thickness ratios of about 0.2, 0.5, and 0.75; crack depth to crack length ratios of about 1.0 to 2.0; and crack length to hole radius ratios of about 0.5 to 2.0. The SIFs were determined at the intersection of the flaw border with the plate surface (KS) and with the edge of the hole (KH). It is shown that extension of a crack emanating from a corner of intersection of a hole with a plate under monotonically increasing load is not self-similar and that as the flaw depth increases, KH decreases and KS increases. Existing theories and design criteria significantly overestimate the SIF at both the hole and the surface except for shallow flaws at the hole and deep flaws at the surface.