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Potting procedure for electronic componentsPotting process is modified to effect a match more closely between embedded electronic components, potting mediums, and thermal environment. Application of room-temperature vulcanizing silicone rubber band cured in modified thermal cycle minimizes coil-to-resin adhesion and thus lowers stresses between transformer and potting compound.
Document ID
19770000324
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Rubino, A. G. (Singer Co.)
Zimmerman, J. (Singer Co.)
Date Acquired
August 8, 2013
Publication Date
November 1, 1977
Publication Information
Publication: NASA Tech Briefs
Volume: 2
Issue: 3
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MSC-16290
Accession Number
77B10324
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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