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SputteringThis paper primarily reviews the potential of using the sputtering process as a deposition technique; however, the manufacturing and sputter etching aspects are also discussed. Since sputtering is not regulated by classical thermodynamics, new multicomponent materials can be developed in any possible chemical composition. The basic mechanism for dc and rf sputtering is described. Sputter-deposition is described in terms of the unique advantageous features it offers such as versatility, momentum transfer, stoichiometry, sputter-etching, target geometry (coating complex surfaces), precise controls, flexibility, ecology, and sputtering rates. Sputtered film characteristics, such as strong adherence and coherence and film morphology, are briefly evaluated in terms of varying the sputtering parameters. Also described are some of the specific industrial areas which are turning to sputter-deposition techniques.
Document ID
19770043547
Document Type
Conference Paper
Authors
Spalvins, T. (NASA Lewis Research Center Cleveland, Ohio, United States)
Date Acquired
August 8, 2013
Publication Date
November 1, 1976
Subject Category
MECHANICAL ENGINEERING
Meeting Information
Symposium of the Mechanical Failures Prevention Group(Gaithersburg, MD)
Distribution Limits
Public
Copyright
Other