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Device/packaging reliability problems of solid-state devices for space applicationsThis paper presents data that has been generated within NASA, especially the Marshall Space Flight Center, concerning several failure mechanisms that have occurred with microelectronic packages. The types of packages that will be discussed are primarily flat packs with 14-24 exit leads that are composed of Kovar electro-deposited nickel and finally gold plated.
Document ID
19770044821
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Villella, F. (NASA Marshall Space Flight Center Huntsville, AL, United States)
Nowakowski, M. F. (NASA Marshall Space Flight Center Electronics and Control Laboratory, Huntsville, Ala., United States)
Date Acquired
August 8, 2013
Publication Date
January 1, 1976
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: EASCON ''76; Electronics and Aerospace Systems Convention
Location: Washington, DC
Start Date: September 26, 1976
End Date: September 29, 1976
Accession Number
77A27673
Distribution Limits
Public
Copyright
Other

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