An analytical and experimental study for surface heat flux determination

A numerical method by which data from a single embedded thermocouple can be used to predict the transient thermal environment for both high- and low-conductivity materials is described. The results of an investigation performed to verify the method clearly demonstrate that accurate transient surface heating conditions can be obtained from a thermocouple 1.016 cm from the surface in a low-conductivity material. Space Shuttle Orbiter thermal protection system materials having temperature- and pressure-dependent properties and typical Orbiter entry heating conditions were used to verify the accuracy of the analytical procedure. Analytically generated, as well as experimental, data were used to compare predicted and measured surface temperatures.