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Match-mold process for foam insulationProcess, using fast-setting putty-type thixotropic epoxy material, eliminates need for leakproof enclosures. Method reduces cure time from 15 to 4 hours. Epoxy masters are stronger and do not require special coating for storage. Manufacturers of form-fitted insulation or packaging forms will find this process to be of interest.
Document ID
19780000126
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Rumenapp, H. E. (Rockwell Intern. Corp.)
Liskay, G. G. (Rockwell Intern. Corp.)
Wang, D. S. (Rockwell Intern. Corp.)
Date Acquired
August 9, 2013
Publication Date
June 1, 1978
Publication Information
Publication: NASA Tech Briefs
Volume: 3
Issue: 1
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MSC-16631
Accession Number
78B10126
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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