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No-warp potted circuitsSponge inserts compensate for potting-compound expansion and relieve thermal stresses on circuit boards. Technique quality of production runs on PC boards intended for applications in environments less severe than those for aerospace equipment. Pads reduce weight of modules because they weigh far less than potting compound they displace.
Document ID
19780000435
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Robinson, W. W. (Rockwell Intern. Corp.)
Date Acquired
August 9, 2013
Publication Date
January 1, 1979
Publication Information
Publication: NASA Tech Briefs
Volume: 3
Issue: 3
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MSC-19729
Accession Number
78B10435
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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