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Accelerated hybrid-circuit productionModified die-bonding machine speeds up hybrid-circuit production. Utilizing two pedestals, one for die tray and another for substrate tray, increased production and decreased error-margin are possible.
Document ID
19780000585
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Berg, J. E.
(Sperry Rand Corp.)
Dassele, M. A.
(Sperry Rand Corp.)
Date Acquired
August 9, 2013
Publication Date
March 1, 1979
Publication Information
Publication: NASA Tech Briefs
Volume: 3
Issue: 4
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MSC-18272
Accession Number
78B10585
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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