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Investigation of package sealing using organic adhesivesA systematic study was performed to evaluate the suitability of adhesives for sealing hybrid packages. Selected adhesives were screened on the basis of their ability to seal gold-plated Kovar butterfly-type packages that retain their seal integrity after individual exposures to increasingly severe temperature-humidity environments. Tests were also run using thermal shock, temperature cycling, mechanical shock and temperature aging. The four best adhesives were determined and further tested in a 60 C/98% RH environment and continuously monitored in regard to moisture content. Results are given, however, none of the tested adhesives passed all the tests.
Document ID
19780008330
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Perkins, K. L.
(Rockwell International Corp. Anaheim, CA, United States)
Licari, J. J.
(Rockwell International Corp. Anaheim, CA, United States)
Date Acquired
August 9, 2013
Publication Date
November 1, 1977
Publication Information
Publication: NASA. Marshall Space Flight Center Proc. of the 1977 NASA(ISHM Microelectronics Conf.
Subject Category
Communications And Radar
Accession Number
78N16273
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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