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Laser drilling of vias in dielectric for high density multilayer LSHI thick film circuitsA design analysis of a high density multilevel thick film digital microcircuit used for large scale integration is presented. The circuit employs 4 mil lines, 4 mil spaces and requires 4 mil diameter vias. Present screened and fired thick film technology is limited on a production basis to 16 mil square vias. A process whereby 4 mil diameter vias can be fabricated in production using laser technology was described along with a process to produce 4 mil diameter vias for conductor patterns which have 4 mil lines and 4 mil spacings.
Document ID
19780008333
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Cocca, T.
(Raytheon Co. Andover, MA, United States)
Dakesian, S.
(Raytheon Co. Andover, MA, United States)
Date Acquired
August 9, 2013
Publication Date
November 1, 1977
Publication Information
Publication: NASA. Marshall Space Flight Center Proc. of the 1977 NASA(ISHM Microelectronics Conf.
Subject Category
Electronics And Electrical Engineering
Accession Number
78N16276
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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